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The mission of Solderwell
The leading provider of electronic materials and application technology solutions in the world,outstanding examples of national enterprises.
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Vision of Solderwell
Always pursue to be a“customers’ approved partner, peers’ respected competitor, suppliers’ trusted friends, employees’ dependable lovers” happy enterprises.
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IGBT Module
焊接器件:IGBT 器件(绝缘栅双极型晶体管); 焊接类型:真空还原气氛焊接; 技术要求:焊后空泡率; 焊片类型:洁净型焊片; 形状尺寸:片状,与被焊面一致;
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